Foranext® for Data Center Cooling
Foranext® is available for multiple aspects of data center cooling including two-phase direct-to-chip cooling, one-phase immersion cooling, and two-phase immersion cooling.
- Worldwide
Data centers have become the key to modern technology, business and leisure but their high power consumption and thermal management needs can make them a challenge when it comes to sustainability.
Microprocessors in artificial intelligence have a significant increase with rack power density due to their thermal design power (TDP).
Building on our unique set of expertise in materials science, Arkema designs solutions to address the ever-growing demand for more efficient and sustainable materials. As companies continue to transition away from air-based thermal management systems, Arkema has developed Foranext® for data center cooling to increase efficiency, safety and sustainability.
TWO-PHASE, DIRECT-TO-CHIP COOLING
- One of the most effective forms of cooling, Direct-To-Chip Cooling uses latent heat, versus sensible heat, to improve the overall thermal performance.
- Foranext® 1233zd for Data Center Cooling, a non-flammable and non-toxic fluid, was designed with to adapt to various boiling points and latent heat making it a valuable option for managing the unique thermal challenges of your data center.
- Arkema maintains a strong and growing patent portfolio of global Foranext® 1233zd intellectual property.
ONE-PHASE IMMERSION COOLING
- In one-phase immersion cooling, the servers are submerged in a tank filled with a dielectric liquid. While it greatly improves overall efficiency, the fluid itself can be flammable.
- Adding Arkema’s Foranext® solution for 1-phase immersion cooling is a fluid additive designed to suppress the dielectric fluid flash point, improving the overall safety of the data center.
TWO-PHASE IMMERSION COOLING
- Like One-Phase Immersion Cooling, Two-Phase Immersion Cooling also uses tanks filled with dielectric fluid.
- The difference lays in the use of specific fluid evaporation in contact with the processors. It offers tremendous thermal performance adapted to extreme heat generated by any microprocessors.
- Foranext® solution for 2-phase immersion cooling involves a non-flammable fluid whose heat capacity properties adapt to the application.