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Foranext® for Data Center Cooling

Discover the Product range Foranext®.
Product overview

Foranext® is available for multiple aspects of data center cooling including two-phase direct-to-chip cooling, one-phase immersion cooling, and two-phase immersion cooling.

Geographic availability
  • Worldwide

Data centers have become the key to modern technology, business and leisure but their high power consumption and thermal management needs can make them a challenge when it comes to sustainability.

Microprocessors in artificial intelligence have a significant increase with rack power density due to their thermal design power (TDP).

Building on our unique set of expertise in materials science, Arkema designs solutions to address the ever-growing demand for more efficient and sustainable materials. As companies continue to transition away from air-based thermal management systems, Arkema has developed Foranext® for data center cooling to increase efficiency, safety and sustainability.
 



 

TWO-PHASE, DIRECT-TO-CHIP COOLING

  • One of the most effective forms of cooling, Direct-To-Chip Cooling uses latent heat, versus sensible heat, to improve the overall thermal performance.
  • Foranext® 1233zd for Data Center Cooling, a non-flammable and non-toxic fluid, was designed with to adapt to various boiling points and latent heat making it a valuable option for managing the unique thermal challenges of your data center.
  • Arkema maintains a strong and growing patent portfolio of global Foranext® 1233zd intellectual property.

ONE-PHASE IMMERSION COOLING

  • In one-phase immersion cooling, the servers are submerged in a tank filled with a dielectric liquid. While it greatly improves overall efficiency, the fluid itself can be flammable.
  • Adding Arkema’s Foranext® solution for 1-phase immersion cooling is a fluid additive designed to suppress the dielectric fluid flash point, improving the overall safety of the data center.

TWO-PHASE IMMERSION COOLING

  • Like One-Phase Immersion Cooling, Two-Phase Immersion Cooling also uses tanks filled with dielectric fluid.
  • The difference lays in the use of specific fluid evaporation in contact with the processors. It offers tremendous thermal performance adapted to extreme heat generated by any microprocessors.
  • Foranext® solution for 2-phase immersion cooling involves a non-flammable fluid whose heat capacity properties adapt to the application.

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